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| CXG1009TN High Isolation SPDT Switch Description The CXG1009TN is a high Isolation SPDT (Single Pole Dual Throw) switch MMIC for personal communication, cable TV and so on. This IC is designed using the Sony's GaAs J-FET process and operates at a single positive control supply. Features * Single positive control supply operation * Insertion Loss 0.7 dB (Typ.) @1.0 GHz, Vctl (H)=3 V 0.8 dB (Typ.) @2.0 GHz, Vctl (H)=3 V * High Isolation 56 dB (Typ.) @1.0 GHz, Vctl (H)=3 V 47 dB (Typ.) @2.0 GHz, Vctl (H)=3 V * 10pin TSSOP package (3.2 x 2.8 mm) Applications * Basestation Lo switching. * Other Low Power SPDT applications requiring high isolation (e.g. Cable TV). Structure GaAs J-FET MMIC 10 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 C) * Control voltage Vctl (H) - Vctl (L) 6 V * Control Current Ictl 2 mA * Operating temperature Topr -35 to +85 C * Storage temperature Tstg -65 to +150 C Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- E98712A8X CXG1009TN Electrical Characteristics VCTL (L) =0 V, VCTL (H) =3 V, Pin=10 dBm Item Insertion Loss 1 Isolation 1 Insertion Loss 2 Isolation 2 VSWR Switching Speed Control Current 1 dB Compression 50 source and load impedance Symbol IL1 ISO1 IL2 ISO2 VSWR TSW ICTL P1dB Condition f 1 GHz f 2 GHz MIN. 52 43 TYP. 0.7 56 0.8 47 1.2 100 60 19 8 MAX. 1.1 1.2 1.5 200 (Ta=25 C) UNit dB dB dB dB ns A dBm dBm 500 MHz f 2 GHz f = 5 MHz 16 Block Diagram Package Outline/Pin Configuration 1 RF3 RF1 RF2 CTLB GND RF1 GND CTLA 10 RF3 GND GND GND RF2 10pin TSSOP (PLASTIC) VCTLA High Low VCTLB Low High RF1-RF2 ON RF1-RF3 OFF RF1-RF2 OFF RF1-RF3 ON --2-- CXG1009TN Recommended Circuit RCTL (1k) CTLB Cbypass (100pF) 1 10 CRF (100pF) RF3 2 9 RF1 CRF (100pF) 3 CXG1009TN 8 4 RCTL (1k) CTLA Cbypass (100pF) 7 5 6 CRF (100pF) RF2 It is necessary to use DC blocking capacitors CRF and bypass capacitors Cbypass. It is necessary to use control resistors RCTL, if current consumption needs to be reduced or ESD performance needs to be improved. It is necessary to oprate at low frequency, DC blocking capacitors CRF needs higher valves. Frequency characteristics Measurement Conditions : Vctl (L) =0 V, Vctl (H) =3 V, Pin=0 dBm CW, T=25 C Insertion Loss and Isolation v.s. Frequency 0 -10 -1 Insertion Loss -20 Insertion Loss (dB) -2 -30 -3 -40 Isolation -4 -50 -5 0 1 Frequency (GHz) 2 3 -60 --3-- Isolation (dB) CXG1009TN Package Outline Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX 2.8 0.1 10 6 0.1 2.2 0.1 + 0.15 0.1 - 0.05 3.2 0.2 1 5 0.5 0.25 0 to 10 + 0.08 0.22 - 0.07 0.1 M (0.2) + 0.08 0.22 - 0.07 DETAIL A NOTE: Dimension "" does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g --4-- (0.1) + 0.025 0.12 - 0.015 A 0.45 0.15 |
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